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NXP USA Inc. |
IC MPU MPC82XX 266MHZ 357BGA |
устарелый | PowerPC 603e | 1 Core, 32-Bit | 266MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
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NXP USA Inc. |
IC MPU MPC82XX 266MHZ 516BGA |
в производстве | PowerPC G2_LE | 1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
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NXP USA Inc. |
IC MPU MPC82XX 266MHZ 516BGA |
в производстве | PowerPC G2_LE | 1 Core, 32-Bit | 266MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
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NXP USA Inc. |
IC MPU MPC52XX 400MHZ 272BGA |
устарелый | PowerPC G2_LE | 1 Core, 32-Bit | 400MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | -40°C ~ 85°C (TA) | - | 272-BBGA | 272-PBGA (27x27) |
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NXP USA Inc. |
IC MPU Q OR IQ 800MHZ 689TEBGA |
в производстве | PowerPC e500v2 | 2 Core, 32-Bit | 800MHz | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU MPC8XX 133MHZ 357BGA |
в производстве | MPC8xx | 1 Core, 32-Bit | 133MHz | Communications; CPM, Security; SEC | DRAM | No | - | 10 Mbps (3), 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 100°C (TA) | Cryptography | 357-BBGA | 357-PBGA (25x25) |
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NXP USA Inc. |
IC MPU MPC82XX 400MHZ 516BGA |
в производстве | PowerPC G2_LE | 1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
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NXP USA Inc. |
IC MPU MPC82XX 266MHZ 352TBGA |
в производстве | PowerPC 603e | 1 Core, 32-Bit | 266MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 352-LBGA | 352-TBGA (35x35) |
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NXP USA Inc. |
IC MPU MPC83XX 667MHZ 689TEBGA |
в производстве | PowerPC e300c4s | 1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU MPC83XX 667MHZ 689TEBGA |
в производстве | PowerPC e300c4s | 1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU I.MX6DP 1GHZ 624FCBGA |
в производстве | ARM® Cortex®-A9 | 2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
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NXP USA Inc. |
IC MPU Q OR IQ 1.055GHZ 689TBGA |
в производстве | PowerPC e500v2 | 1 Core, 32-Bit | 1.055GHz | Security; SEC | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU Q OR IQ 1.067GHZ 689TBGA |
в производстве | PowerPC e500v2 | 1 Core, 32-Bit | 1.067GHz | - | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU MPC82XX 350MHZ 352TBGA |
в производстве | PowerPC 603e | 1 Core, 32-Bit | 350MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 352-LBGA | 352-TBGA (35x35) |
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NXP USA Inc. |
IC MPU MPC83XX 667MHZ 672TBGA |
в производстве | PowerPC e300 | 1 Core, 32-Bit | 667MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 672-LBGA | 672-TBGA (35x35) |
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NXP USA Inc. |
IC MPU Q OR IQ 800MHZ 689TEBGA |
в производстве | PowerPC e500v2 | 2 Core, 32-Bit | 800MHz | Communications; QUICC Engine, Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU MPC82XX 333MHZ 352TBGA |
в производстве | PowerPC 603e | 1 Core, 32-Bit | 333MHz | - | SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 352-LBGA | 352-TBGA (35x35) |
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NXP USA Inc. |
IC MPU MPC8XX 100MHZ 357BGA |
в производстве | MPC8xx | 1 Core, 32-Bit | 100MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
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NXP USA Inc. |
IC MPU Q OR IQ 1.2GHZ 689TEBGA |
в производстве | PowerPC e500v2 | 2 Core, 32-Bit | 1.2GHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU Q OR IQ 1.2GHZ 689TEBGA |
в производстве | PowerPC e500v2 | 2 Core, 32-Bit | 1.2GHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU Q OR IQ 1.2GHZ 689TEBGA |
в производстве | PowerPC e500v2 | 2 Core, 32-Bit | 1.2GHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
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NXP USA Inc. |
IC MPU MPC82XX 266MHZ 480TBGA |
устарелый | PowerPC G2 | 1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 480-TBGA (37.5x37.5) |
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Texas Instruments |
SITARA PROCESSOR ARM CORTEX-A8 |
в производстве | ARM® Cortex®-A8 | 1 Core, 32-Bit | 300MHz | Multimedia; NEON™ SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (1) | 1.8V, 3.3V | 0°C ~ 90°C (TJ) | Cryptography, Random Number Generator | 289-LFBGA | 298-NFBGA (13x13) |
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Texas Instruments |
SITARA PROCESSOR ARM CORTEX-A8 |
в производстве | ARM® Cortex®-A8 | 1 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (1) | 1.8V, 3.3V | 0°C ~ 90°C (TJ) | Cryptography, Random Number Generator | 298-LFBGA | 298-NFBGA (13x13) |
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Microchip Technology |
IC MCU 32BIT EXT MEM 196TFBGA |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 196-TFBGA, CSBGA | 196-TFBGA (11x11) |
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Microchip Technology |
IC MCU 32BIT EXT MEM 256TFBGA |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 256-TFBGA | 256-TFBGA (8x8) |
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Microchip Technology |
IC MCU 32BIT 128KB ROM 217BGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | - | LPDDR, LPDDR2, DDR2, SDR, SRAM | No | LCD, Touchscreen | - | - | USB 2.0 (2) | 1.8V, 3.3V | -40°C ~ 85°C (TA) | - | 217-LFBGA | 217-LFBGA (15x15) |
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Texas Instruments |
SITARA PROCESSOR ARM CORTEX-A8 |
в производстве | ARM® Cortex®-A8 | 1 Core, 32-Bit | 300MHz | Multimedia; NEON™ SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (1) | 1.8V, 3.3V | -40°C ~ 105°C (TJ) | Cryptography, Random Number Generator | 298-LFBGA | 298-NFBGA (13x13) |
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Microchip Technology |
IC MCU 32BIT EXT MEM 196TFBGA |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 196-TFBGA, CSBGA | 196-TFBGA (11x11) |
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Microchip Technology |
IC MCU 32BIT 64KB ROM 217BGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | - | LPDDR, LPDDR2, DDR2, DDR, SDR, SRAM | No | LCD, Touchscreen | 10/100 Mbps | - | USB 2.0 (3) | 1.8V, 2.5V, 3.0V, 3.3V | -40°C ~ 85°C (TA) | - | 217-LFBGA | 217-LFBGA (15x15) |
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Microchip Technology |
IC MCU 32BIT EXT MEM 196TFBGA |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 196-TFBGA, CSBGA | 196-TFBGA (11x11) |
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Microchip Technology |
IC MCU 32BIT EXT MEM 256TFBGA |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 256-TFBGA | 256-TFBGA (8x8) |
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Microchip Technology |
IC MCU 32BIT EXT MEM 289LFBGA |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 289-LFBGA | 289-LFBGA (14x14) |
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Microchip Technology |
IC MCU 32BIT 32KB ROM 217BGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 180MHz | - | SDRAM, SRAM | No | - | 10/100 Mbps | - | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 85°C (TA) | - | 217-LFBGA | 217-LFBGA (15x15) |
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Microchip Technology |
BGA GREEN IND TEMP |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | 1.2V, 1.8V, 3.3V | -40°C ~ 85°C (TA) | AES, SHA, TDES, TRNG | 289-LFBGA | 289-LFBGA (14x14) |
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Microchip Technology |
IC MCU 32BIT 32KB ROM 217BGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 190MHz | - | SDRAM, SRAM | No | LCD | - | - | USB 2.0 (2) | 3.0V, 3.3V | -40°C ~ 85°C (TA) | - | 217-LFBGA | 217-LFBGA (15x15) |
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Microchip Technology |
BGA GREEN IND TEMPMRLB |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | 1.2V, 1.8V, 3.3V | -40°C ~ 85°C (TA) | AES, SHA, TDES, TRNG | 289-LFBGA | 289-LFBGA (14x14) |
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Microchip Technology |
IC MCU 32BIT 64KB ROM 247TFBGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | - | SDRAM, SRAM | No | - | 10/100 Mbps | - | USB 2.0 (2) | 1.8V, 3.3V | -40°C ~ 85°C (TA) | - | 247-TFBGA | 247-TFBGA (10x10) |
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Microchip Technology |
BGA GREEN IND TEMPMRLB |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | 1.2V, 1.8V, 3.3V | -40°C ~ 85°C (TA) | AES, SHA, TDES, TRNG | 289-LFBGA | 289-LFBGA (14x14) |
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Microchip Technology |
BGA GREEN IND TEMPMRLB |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | 1.2V, 1.8V, 3.3V | -40°C ~ 85°C (TA) | AES, SHA, TDES, TRNG | 361-TFBGA | 361-TFBGA (16x16) |
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Microchip Technology |
IC MCU 32BIT 160KB ROM 324LFBGA |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 536MHz | - | LPDDR, LPDDR2, DDR2 | No | Touchscreen | 10/100/1000 Mbps (1) | - | USB 2.0 (3) | 1.2V, 1.8V, 3.3V | -40°C ~ 105°C (TA) | AES, SHA, TDES, TRNG | 324-LFBGA | 324-LFBGA (15x15) |
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Microchip Technology |
BGA GREEN IND TEMPMRLC128MBIT |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 196-TFBGA, CSBGA | 196-TFBGA (11x11) |
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Microchip Technology |
BGA GREEN IND TEMPMRLB |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | 1.2V, 1.8V, 3.3V | -40°C ~ 85°C (TA) | AES, SHA, TDES, TRNG | 361-TFBGA | 361-TFBGA (16x16) |
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Microchip Technology |
IC MCU 32BIT 64KB ROM 324TFBGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | - | LPDDR, LPSDR, DDR2, SDR, SRAM | No | LCD, Touchscreen | 10/100 Mbps | - | USB 2.0 (3) | 1.8V, 3.3V | -40°C ~ 85°C (TA) | - | 324-TFBGA | 324-TFBGA (15x15) |
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Microchip Technology |
IC MCU 32BIT 64KB ROM 324TFBGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | - | LPDDR, LPSDR, DDR2, SDR, SRAM | No | LCD, Touchscreen, Video Decoder | 10/100 Mbps | - | USB 2.0 (3) | 1.8V, 3.3V | -40°C ~ 85°C (TA) | - | 324-TFBGA | 324-TFBGA (15x15) |
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NXP USA Inc. |
IC MPU I.MX25 400MHZ 400MAPBGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | - | LPDDR, DDR, DDR2 | No | Keypad | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -40°C ~ 85°C (TA) | - | 400-LFBGA | 400-MAPBGA (17x17) |
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Microchip Technology |
BGA GREEN IND TEMPMRLC512MBIT |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 289-LFBGA | 289-LFBGA (14x14) |
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NXP USA Inc. |
IC MPU I.MX25 400MHZ 400MAPBGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | - | LPDDR, DDR, DDR2 | No | Keypad | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -40°C ~ 85°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | 400-LFBGA | 400-MAPBGA (17x17) |
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Microchip Technology |
BGA GREEN IND TEMPMRLC1GBIT D |
в производстве | ARM® Cortex®-A5 | 1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 85°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 289-TFBGA | 289-TFBGA (14x14) |
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NXP USA Inc. |
IC MPU I.MX25 400MHZ 400MAPBGA |
в производстве | ARM926EJ-S | 1 Core, 32-Bit | 400MHz | - | LPDDR, DDR, DDR2 | No | Keypad, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -40°C ~ 85°C (TA) | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | 400-LFBGA | 400-MAPBGA (17x17) |
