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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8DIP |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-DIP |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8SOIC |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8SOIC |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8DIP |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8DIP |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8SOIC |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8MSOP |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8MSOP |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMP 1.6V SGL P-P W/CS 8-SOIC |
в производстве | General Purpose | 1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP SNGL W/REF SC70-5 |
в производстве | with Voltage Reference | 1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 5-TSSOP, SC-70-5, SOT-353 | SMD Поверхностный монтаж | SC-70-5 |
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Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-DIP |
в производстве | General Purpose | 2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP 1.6V DUAL O-D 8DIP |
в производстве | General Purpose | 2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMP 1.6V DUAL P-P 8SOIC |
в производстве | General Purpose | 2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 8-SOIC |
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Microchip Technology |
IC COMP 1.6V SNGL O-D 8MSOP |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMPARATOR MICROPOWER 6MLF |
в производстве | with Voltage Reference | 1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | SMD Поверхностный монтаж | 6-TDFN (1.6x1.6) |
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Microchip Technology |
IC COMPARATOR MICROPOWER 6MLF |
в производстве | with Voltage Reference | 1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | SMD Поверхностный монтаж | 6-TDFN (1.6x1.6) |
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Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP |
в производстве | General Purpose | 1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | SMD Поверхностный монтаж | 8-MSOP |
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Microchip Technology |
IC COMPARATOR MICROPOWER 4TDFN |
в производстве | with Voltage Reference | 1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | SMD Поверхностный монтаж | 4-TDFN (1.2x1.6) |
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Microchip Technology |
IC COMPARATOR MICROPOWER 4TDFN |
в производстве | with Voltage Reference | 1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | SMD Поверхностный монтаж | 4-TDFN (1.2x1.6) |
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Microchip Technology |
IC COMPARATOR MICROPOWER 6MLF |
в производстве | with Voltage Reference | 1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | SMD Поверхностный монтаж | 4-TDFN (1.2x1.6) |
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Microchip Technology |
IC COMPARATOR MICROPOWER 4MLF |
в производстве | with Voltage Reference | 1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | SMD Поверхностный монтаж | 4-TDFN (1.2x1.6) |
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Microchip Technology |
IC COMPARATOR MICROPOWER 4MLF |
в производстве | with Voltage Reference | 1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | SMD Поверхностный монтаж | 4-TDFN (1.2x1.6) |
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Microchip Technology |
IC COMP 1.6V QUAD O-D 14DIP |
в производстве | General Purpose | 4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-DIP (0.300", 7.62mm) | Through Hole | 14-PDIP |
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Microchip Technology |
IC COMP OPENDRN 1.6V QUAD 14-DIP |
в производстве | General Purpose | 4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-DIP (0.300", 7.62mm) | Through Hole | 14-PDIP |
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Microchip Technology |
IC COMP PP I/O QUAD 1.6V 14DIP |
в производстве | General Purpose | 4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-DIP (0.300", 7.62mm) | Through Hole | 14-PDIP |
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Microchip Technology |
IC COMP PP I/O QUAD 1.6V 14TSSOP |
в производстве | General Purpose | 4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-TSSOP (0.173", 4.40mm Width) | SMD Поверхностный монтаж | 14-TSSOP |
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Microchip Technology |
IC COMP 1.6V QUAD P-P 14SOIC |
в производстве | General Purpose | 4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 14-SOIC |
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Microchip Technology |
IC COMP 1.6V QUAD O-D 14SOIC |
в производстве | General Purpose | 4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 14-SOIC |
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Microchip Technology |
IC COMP 1.6V QUAD P-P 14TSSOP |
в производстве | General Purpose | 4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | SMD Поверхностный монтаж | 14-TSSOP |
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Microchip Technology |
IC COMP 1.6V QUAD O-D 14TSSOP |
в производстве | General Purpose | 4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | SMD Поверхностный монтаж | 14-TSSOP |
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Microchip Technology |
IC COMP OPENDRN 1.6V QUAD 14SOIC |
в производстве | General Purpose | 4 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 14-SOIC |
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Microchip Technology |
IC COMP PP I/O DUAL 1.6V 14SOIC |
в производстве | General Purpose | 4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 14-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 14-SOIC |
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Microchip Technology |
IC COMP QUAD 1.8V PP 14-SOIC |
в производстве | General Purpose | 4 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 14-SOIC |
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Microchip Technology |
IC COMP QUAD 1.8V OD 14-SOIC |
в производстве | General Purpose | 4 | CMOS, Open-Drain | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 14-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 14-SOIC |
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Microchip Technology |
IC COMP QUAD 1.8V OD 14-TSSOP |
в производстве | General Purpose | 4 | CMOS, Open-Drain | 1.8 V ~ 5.5 V | 10mV @ 5.5V | 1pA @ 5.5V | 50mA | 130µA | 66dB CMRR, 70dB PSRR | 80ns | 5mV | -40°C ~ 125°C | 14-TSSOP (0.173", 4.40mm Width) | SMD Поверхностный монтаж | 14-TSSOP |
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Microchip Technology |
IC COMPARATOR 1.8V QUAD 16SOIC |
устарелый | with Voltage Reference | 4 | Rail-to-Rail | 1.8 V ~ 5.5 V | 5mV @ 3V | 100pA @ 5.5V | 2mA @ 5.5V | 26µA | 66dB CMRR, 60dB PSRR | - | - | -40°C ~ 85°C | 16-SOIC (0.154", 3.90mm Width) | SMD Поверхностный монтаж | 16-SOIC |
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Microchip Technology |
IC COMPARATOR 1.8V DUAL 8DIP |
устарелый | General Purpose | 2 | Rail-to-Rail | 1.8 V ~ 5.5 V | 5mV @ 3V | 100pA @ 5.5V | 2mA @ 5.5V | 12µA | 66dB CMRR, 60dB PSRR | - | - | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
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Microchip Technology |
IC COMPARATOR PREC 2-36V SOT23-5 |
Discontinued at - | General Purpose | 1 | CMOS, DTL, ECL, MOS, Open-Collector, TTL | 2 V ~ 36 V, ±1 V ~ 18 V | 5mV @ 5V | 0.25µA @ 5V | 20mA @ 5V | 1.2mA | - | - | - | -40°C ~ 85°C | SC-74A, SOT-753 | SMD Поверхностный монтаж | SOT-23-5 |
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Microchip Technology |
IC COMPARATOR R-R INPUT SOT23-5 |
Discontinued at - | General Purpose | 1 | Push-Pull | 2.2 V ~ 10 V | 10mV @ 5V | 0.5pA @ 5V | - | 25µA | 70dB CMRR, 90dB PSRR | 5µs | - | -40°C ~ 85°C | SC-74A, SOT-753 | SMD Поверхностный монтаж | SOT-23-5 |
